Adhesion of 14mm coated aggregate for chip seal application

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書誌詳細
第一著者:	Nur Sarfina Nawawi
その他の著者:	Haryati Yaacob, supervisor
フォーマット:	Bachelor thesis
言語:	英語
出版事項:	Universiti Teknologi Malaysia 2025
主題:	Civil engineering
オンライン･アクセス:	https://utmik.utm.my/handle/123456789/46697
Abstract	Abstract here

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