Development on copper to copper bonding optimization on low-k structure integrated circuit device

Wire bonding technology has been widely used in the semiconductor industry for interconnection between chip and lead frame or substrate.Gold (Au) is the most widely used metal for Integrated Circuit (IC) wire bonding because of its resistance to surface corrosion and high productivity through the Au...

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主要作者:	Chan, Swee Guan
格式:	Thesis
語言:	英语 英语
出版:	2016
主題:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
在線閱讀:	http://eprints.utem.edu.my/id/eprint/20494/1/Development%20on%20copper%20to%20copper%20bonding%20optimization%20on%20low-k%20structure%20integrated%20circuit%20device.pdf http://eprints.utem.edu.my/id/eprint/20494/2/Development%20on%20copper%20to%20copper%20bonding%20optimization%20on%20low-k%20structure%20integrated%20circuit%20device.pdf