Development on copper to copper bonding optimization on low-k structure integrated circuit device
Wire bonding technology has been widely used in the semiconductor industry for interconnection between chip and lead frame or substrate.Gold (Au) is the most widely used metal for Integrated Circuit (IC) wire bonding because of its resistance to surface corrosion and high productivity through the Au...
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| Format: | Thèse |
| Langue: | anglais anglais |
| Publié: |
2016
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| Accès en ligne: | http://eprints.utem.edu.my/id/eprint/20494/1/Development%20on%20copper%20to%20copper%20bonding%20optimization%20on%20low-k%20structure%20integrated%20circuit%20device.pdf http://eprints.utem.edu.my/id/eprint/20494/2/Development%20on%20copper%20to%20copper%20bonding%20optimization%20on%20low-k%20structure%20integrated%20circuit%20device.pdf |
Internet
http://eprints.utem.edu.my/id/eprint/20494/1/Development%20on%20copper%20to%20copper%20bonding%20optimization%20on%20low-k%20structure%20integrated%20circuit%20device.pdfhttp://eprints.utem.edu.my/id/eprint/20494/2/Development%20on%20copper%20to%20copper%20bonding%20optimization%20on%20low-k%20structure%20integrated%20circuit%20device.pdf