Solder paste printing yield improvement for SMT ultra fine pitch product by using six sigma technique

Surface mount technology (SMT) is a method for producing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs). It has been emerged in the 1960s,gained momentum in the early 1980s and became widely used by the mid-1990s and is continually...

詳細記述

書誌詳細

第一著者:	Lim, Kean Teik
フォーマット:	学位論文
言語:	英語 英語
出版事項:	2016
主題:	T Technology (General) TK Electrical engineering. Electronics Nuclear engineering
オンライン･アクセス:	http://eprints.utem.edu.my/id/eprint/20512/1/Solder%20paste%20printing%20yield%20improvement%20for%20SMT%20ultra%20fine%20pitch%20product%20by%20using%20six%20sigma%20technique.pdf http://eprints.utem.edu.my/id/eprint/20512/2/Solder%20paste%20printing%20yield%20improvement%20for%20SMT%20ultra%20fine%20pitch%20product%20by%20using%20six%20sigma%20technique.pdf