Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress

Quality requirement in the semiconductor industry is getting more stringent due to the application of semiconductor components that are widely used in automotive. Furthermore different materials combination is being introduced to semiconductor packages to improve their package performance and reduce...

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主要作者:	Lee, Cher Chia
格式:	Thesis
语言:	英语 英语
出版:	UTeM 2017
主题:	T Technology (General) TS Manufactures
在线阅读:	http://eprints.utem.edu.my/id/eprint/23786/1/Modelling%20Of%20Wire%20Bonding%20Cu-Al%20Intermetallic%20Formation%20Growth%20Towards%20Interfacial%20Stress%20-%20Lee%20Cher%20Chia%20-%2024%20Pages.pdf http://eprints.utem.edu.my/id/eprint/23786/2/Modelling%20Of%20Wire%20Bonding%20Cu-Al%20Intermetallic%20Formation%20Growth%20Towards%20Interfacial%20Stress.pdf