Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board

Critical evaluation of interconnection materials developed from composite solder materials and a comprehensive comparison of the joints with the host solder alloy are cardinal to the quest of divulging a more decent and dependable alternative to the existing solder candidate. In this study, the effe...

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書誌詳細

第一著者:	Dele-Afolabi, Temitope Theophilus
フォーマット:	学位論文
言語:	英語
出版事項:	2015
主題:	Intermetallic compounds Composite materials Structural analysis (Engineering)
オンライン･アクセス:	http://psasir.upm.edu.my/id/eprint/56593/1/FK%202015%2014RR.pdf
Abstract	Abstract here