Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board
Critical evaluation of interconnection materials developed from composite solder materials and a comprehensive comparison of the joints with the host solder alloy are cardinal to the quest of divulging a more decent and dependable alternative to the existing solder candidate. In this study, the effe...
| Auteur principal: | |
|---|---|
| Format: | Thèse |
| Langue: | anglais |
| Publié: |
2015
|
| Sujets: | |
| Accès en ligne: | http://psasir.upm.edu.my/id/eprint/56593/1/FK%202015%2014RR.pdf |