Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board
Critical evaluation of interconnection materials developed from composite solder materials and a comprehensive comparison of the joints with the host solder alloy are cardinal to the quest of divulging a more decent and dependable alternative to the existing solder candidate. In this study, the effe...
| मुख्य लेखक: | |
|---|---|
| स्वरूप: | थीसिस |
| भाषा: | अंग्रेज़ी |
| प्रकाशित: |
2015
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| विषय: | |
| ऑनलाइन पहुंच: | http://psasir.upm.edu.my/id/eprint/56593/1/FK%202015%2014RR.pdf |